欢迎登录材料期刊网

材料期刊网

高级检索

  • 论文(2)
  • 图书()
  • 专利()
  • 新闻()

Microbridge Testing of Young's Modulus and Residual Stress of Nickel Film Electroplated on Silicon Wafer

Y. Zhou , C.S. Yang , J.A. Chen , G.F. Ding , L. Wang , M.J. Wang , Y.M. Zhang , T.H. Zhang

金属学报(英文版)

Microbridge testing is used to measure the Young's modulus and residual stresses of metallic films. Nickel film microbridges with widths of several hundred microns are fabricated by Microelectromechanical Systems. In order to measure the mechanical properties of nickel film microbridges, special shaft structure is designed to solve the problem of getting the load-deflection curves of metal film microbridge by Nanoindenter XP system with normal Berkovich probe. Theoretical analysis of the microbridge load-deflection curve is proposed to evaluate the Young's modulus and residual stress of the films simultaneously. The calculated results based on the experimental measurements show that the average Young's modulus and residual stress are around 190GPa and 175MPa respectively, while the Young's modulus measured by Nano- hardness method on nickel film with silicon substrate is 186.8±7.34GPa.

关键词: nickel film microbridge , null , null , null

出版年份

刊物分类

相关作者

相关热词